Designing High-Dense-Packed Electronic Equipment using Three-Dimensional Printed Wiring

Author: Efimenko A. A. – Dr. Sc., Associate Professor, Odessa, Ukraine. General summary Modern electronic equipment is often characterized ...

Author: Efimenko A. A. – Dr. Sc., Associate Professor, Odessa, Ukraine.

General summary

Modern electronic equipment is often characterized not only by its miniature size but also by its complex volume, requiring the placement of electronic components and associated electrical connections with maximum volume fill factor. This is why design and technological solutions have been implemented for a long time, including flexible printed circuit boards, rigid-flexible printed circuit boards and associated assemblies, and 3D-MID technology (three-dimensional molded interconnect device), taking into account all known modifications. A clear advantage that unites them and allows for their effective use in irregularly shaped volumes is their ability to create three-dimensional structures based on printed circuit boards. The effective use of these methods necessitates their development and objective methods for optimal selection for specific electronic equipment.

To confirm the popularity and ongoing development of 3D printed circuit boards, a literature review is provided, and some representative illustrations are provided for a better understanding.

To further develop and rationally utilize a three-dimensional printed wiring (TDPW), the following methods are proposed in this paper:

A method for creating a rigid-flexible printed circuit board (PCB). This design and manufacturing method is intended for creating printed circuit boards and, correspondingly, printed circuit assemblies that have a rigid-flexible three-dimensional structure for the placement and connection of electronic components. The primary motivation for developing the proposed method was the economic component—the use of simpler processes, equipment, and materials compared to existing rigid-flexible PCB technologies.

A method for selecting TDPW. Two approaches are proposed for developing the method: one using a heuristic method and the other using passive game theory. The first approach is based on an expert assessment of the proposed TDPWs. The second approach utilizes a number of TDPW parameters that have a mathematical representation. By calculating these coefficients and parameters, we can determine the optimal TDPW option for the electronic device being developed.

To confirm the feasibility of the rigid-flexible PCB manufacturing method, an experimental test of the manufacturing processes was conducted. Two single-sided foil-clad fiberglass blanks were used as the basis, one with a continuous foil layer and the other with foil traces. The experimental results are illustrated in photographs.

The selection of TDPW types using a heuristic method and passive game theory is demonstrated using specific examples.

Article Link: https://journalspress.com/LJER_Volume25/Designing-High-Dense-Packed-Electronic-Equipment-using-Three-Dimensional-Printed-Wiring.pdf